The Surface Residual Stress of Cemented Carbides Coated with TiC or TiN by Chemical Vapour Deposition Process and Physical Vapour Deposition Process

Synthesis of Tin Nitride SnxNyNanowires by Chemical Vapour Deposition

Tin nitride (Sn(x)N(y)) nanowires have been grown for the first time by chemical vapour deposition on n-type Si(111) and in particular by nitridation of Sn containing NH(4)Cl at 450 degrees C under a steady flow of NH(3). The Sn(x)N(y) nanowires have an average diameter of 200 nm and lengths >/=5 mum and were grown on Si(111) coated with a few nm's of Au. Nitridation of Sn alone, under a flow o...

Physical Vapour Deposition Techniques for Producing Advanced Organic Chemical Sensors

Synthesis of Boron-Aluminum Nitride Thin Film by Chemical Vapour Deposition Using Gas Bubbler

Boron included aluminium nitride (B-AlN) thin films were synthesized on silicon (Si) substrates through chemical vapour deposition ( CVD ) at 773 K (500 °C). tert-buthylamine (tBuNH2) solution was used as nitrogen source and delivered through gas bubbler. B-AlN thin films were prepared on Si-100 substrates by varying gas mixture ratio of three precursors. The structural properties of the films ...

Chemical Vapour Deposition for Optical Fibre Technology

At the beginning of the seventies, a break-through took place in the telecommunication research. The introduction of Chemical Vapour Deposition technology in the manufacture of optical fibres allowed both technical quality and economical convenience to realise optical networks, thus beginning the telecommunication revolution. Since that moment, a great development of the CVD techniques has been...

Gold catalytic Growth of Germanium Nanowires by chemical vapour deposition method

Germanium nanowires (GeNWs) were synthesized using chemical vapor deposition (CVD) based on vapor–liquid–solid (VLS) mechanism with Au nanoparticles as catalyst and germanium tetrachloride (GeCl4) as a precursor of germanium. Au catalysts were deposited on silicon wafer as a thin film, firstly by sputtering technique and secondly by submerging the silicon substrates in Au colloidal s...